The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2011

Filed:

Aug. 27, 2007
Applicants:

Rodney Rigby, Riverton, UT (US);

James Frisby, Lehi, UT (US);

Aaron Parr, Sandy, UT (US);

Yasuhisa Yamamoto, Yokohama, JP;

Inventors:

Rodney Rigby, Riverton, UT (US);

James Frisby, Lehi, UT (US);

Aaron Parr, Sandy, UT (US);

Yasuhisa Yamamoto, Yokohama, JP;

Assignee:

Cadence Design Systems, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C 5/00 (2006.01); G03F 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Double patterning is achieved with a single reticle while maintaining the integrity of in-scribe patterns and without blading the reticle. In-scribe structures may or may not be double patterning. For example, elements such as electrical test structures might have features that are so closely spaced that double pattering is desired. However, elements such as optical alignment marks might not require double patterning. For those elements for which double patterning is not desired, a first sub-array of the reticle has a pattern for the element, whereas the corresponding location in a second sub-array has a blank. By the corresponding location, it is meant the location on the reticle that would be exposed to the same target region to which the element would be exposed if the reticle were used for double patterning. Thus, the blank prevents target region from being exposed more than once.


Find Patent Forward Citations

Loading…