The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Nov. 03, 2006
Huyen Karen Tran, San Jose, CA (US);
Renhe Jia, Berkeley, CA (US);
You Wang, Cupertino, CA (US);
Stan D. Tsai, Fremont, CA (US);
Martin S. Wohlert, San Jose, CA (US);
Daxin Mao, Cupertino, CA (US);
Huyen Karen Tran, San Jose, CA (US);
Renhe Jia, Berkeley, CA (US);
You Wang, Cupertino, CA (US);
Stan D. Tsai, Fremont, CA (US);
Martin S. Wohlert, San Jose, CA (US);
Daxin Mao, Cupertino, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. The method includes providing a substrate comprising dielectric feature definitions, a barrier material disposed in the feature definitions, and a bulk conductive material disposed on the barrier material in an amount sufficient to fill feature definitions; polishing the substrate to substantially remove the bulk conductive material; polishing a residual conductive material to expose feature definitions, comprising: applying a first voltage for a first time period, wherein the first voltage is less than the critical voltage; and applying a second voltage for a second time period, wherein the second voltage is greater than the critical voltage.