The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2011

Filed:

Apr. 29, 2009
Applicants:

Sun-woo Lee, Incheon, KR;

Seong-ho Moon, Suwon-si, KR;

Dong-woo Kim, Incheon, KR;

Jung-hyeon Kim, Hwaseong-si, KR;

Hong-sik Yoon, Seongnam-si, KR;

Inventors:

Sun-Woo Lee, Incheon, KR;

Seong-Ho Moon, Suwon-si, KR;

Dong-Woo Kim, Incheon, KR;

Jung-Hyeon Kim, Hwaseong-si, KR;

Hong-Sik Yoon, Seongnam-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of forming a wiring having a carbon nanotube, a lower wiring is formed on a substrate, and a catalyst layer is formed on the lower wiring. An insulating interlayer is formed on the substrate to cover the catalyst layer, and an opening is formed through the insulating interlayer to expose an upper face of the catalyst layer. A carbon nanotube wiring is formed in the opening, and an upper wiring is formed on the carbon nanotube wiring and the insulating interlayer to be electrically connected to the carbon nanotube wiring. A thermal stress is generated between the carbon nanotube wiring and the upper wiring to produce a dielectric breakdown of a native oxide layer formed on a surface of the carbon nanotube wiring. A wiring having a reduced electrical resistance between the carbon nanotube wiring and the upper wiring may be obtained.


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