The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2011

Filed:

Sep. 11, 2006
Applicants:

Hiroshi Nakano, Chikusei, JP;

Hiroshi Yoshida, Mito, JP;

Masatoshi Sugimasa, Tokai, JP;

Katsumi Mabuchi, Hitachi, JP;

Haruo Akahoshi, Hitachi, JP;

Inventors:

Hiroshi Nakano, Chikusei, JP;

Hiroshi Yoshida, Mito, JP;

Masatoshi Sugimasa, Tokai, JP;

Katsumi Mabuchi, Hitachi, JP;

Haruo Akahoshi, Hitachi, JP;

Assignee:

Hitachi Cable, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/78 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an electrode in electrochemical device, particularly an anode lithium ion secondary battery, a cathode for use in alkali storage battery, an electrode for use in fuel cell, or a capacitor electrode, a metal structure has nano size micro-pillars is constructed with an electrode active material being formed on the surface of the metal structure. The metal structure having nano size micro-pillars can be formed, for example, by forming a metal layer as an electrode material by plating to the surface of a substrate having pores and then removing the substrate by dissolution, the metal filled in the pores of the substrate to form a group of micro-pillars. And the active material can be formed by depositing metal by plating. Since the active material is in direct contact with the conductive skeleton, the conducting agent for connecting the active materials to each other may not be added at all.


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