The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2011

Filed:

Oct. 11, 2007
Applicants:

Nobuhiro Nakamura, Yokohama, JP;

Syuji Matsumoto, Yokohama, JP;

Hitoshi Onoda, Yokohama, JP;

Yutaka Segawa, Yokohama, JP;

Tetsuro Matsumoto, Yokohama, JP;

Hiroshi Usui, Yokohama, JP;

Inventors:

Nobuhiro Nakamura, Yokohama, JP;

Syuji Matsumoto, Yokohama, JP;

Hitoshi Onoda, Yokohama, JP;

Yutaka Segawa, Yokohama, JP;

Tetsuro Matsumoto, Yokohama, JP;

Hiroshi Usui, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 1/62 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

A diode chip is sealed by a glass material. There are provided a light emitting diode chip and a glass member in close contact with at least one portion of the surface of the light emitting diode chip. The glass member has a surface shape containing a curved surface at least a portion thereof. The curved surface is preferably a portion of a spherical surface or a spheroidal surface. The glass member has a surface shape containing a spherical portion and a flat portion, and the diode chip is preferably disposed on the flat portion.


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