The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Dec. 21, 2007
Applicant:
Akinobu Inoue, Nagano, JP;
Inventor:
Akinobu Inoue, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder balls, an opening portion opened larger than a planar shape of the electronic component is formed in the other wiring substrate, which faces to one wiring substrate on which the electronic component is mounted, in a position that opposes the electronic component, and a space between a pair of wiring substrates is sealed with a sealing resin.