The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Mar. 27, 2006
Chris Wyland, Livermore, CA (US);
Chris Wyland, Livermore, CA (US);
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-chu, TW;
Abstract
A bond pad structure () for an integrated circuit (IC) device uses carbon nanotubes to increase the strength and resilience of wire bonds (). In an example embodiment there is, a bond pad structure () on an IC substrate, the bond pad structure comprises, a first conductive layer () having a top surface and a bottom surface, the bottom surface attached to the IC substrate. A dielectric layer () is deposited on the top surface of the first conductive layer (), the dielectric layer having an array of vias (), the array of vias filled with a carbon nanotube material (), the carbon nanotube material () is electrically coupled to the first conductive layer (). There is a second conductive layer () having a top surface and a bottom surface, the bottom surface of the second conductive layer is electrically coupled to the carbon nanotube material (). A feature of this embodiment may include the first () or second () conductive layer being comprised of carbon nanotube material, as well.