The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Jul. 25, 2008
Kazumasa Takeuchi, Chikusei, JP;
Makoto Yanagida, Chikusei, JP;
Masaki Yamaguchi, Chikusei, JP;
Katsuyuki Masuda, Chikusei, JP;
Kazumasa Takeuchi, Chikusei, JP;
Makoto Yanagida, Chikusei, JP;
Masaki Yamaguchi, Chikusei, JP;
Katsuyuki Masuda, Chikusei, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.