The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2011

Filed:

Jan. 25, 2008
Applicant:

Sumio Ogawa, Tokyo, JP;

Inventor:

Sumio Ogawa, Tokyo, JP;

Assignee:

Elpida Memory, Inc., Chuo-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 21/82 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes plural fuse elements which can be disconnected by irradiating a laser beam, and attenuation members which are located between the plural fuse elements as viewed two-dimensionally and can attenuate the laser beam. Each attenuation member includes plural columnar bodies. With this arrangement, the attenuation members including plural columnar units absorb the laser beam leaked out from a fuse element to be disconnected to a semiconductor substrate side. The laser beam is also scattered by Fresnel diffraction. Therefore, the columnar body can efficiently attenuate the laser beam, without generating a crack in the insulation film by absorbing excessive energy.


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