The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
May. 18, 2007
Robert D. Allen, San Jose, CA (US);
Phillip Brock, Sunnyvale, CA (US);
Blake W. Davis, Hollister, CA (US);
Qinghuang Lin, Yorktown Heights, NY (US);
Robert D. Miller, San Jose, CA (US);
Alshakim Nelson, Freemont, CA (US);
Ratnam Sooriyakumaran, San Jose, CA (US);
Robert D. Allen, San Jose, CA (US);
Phillip Brock, Sunnyvale, CA (US);
Blake W. Davis, Hollister, CA (US);
Qinghuang Lin, Yorktown Heights, NY (US);
Robert D. Miller, San Jose, CA (US);
Alshakim Nelson, Freemont, CA (US);
Ratnam Sooriyakumaran, San Jose, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method. The method includes dip coating a film of a composition on a silicon wafer substrate. The composition includes a polymer blend of a first polymer and a second polymer. The first polymer is a substituted silsesquioxane copolymer. The second polymer is a polysilsesquioxane having silanol end groups. The composition includes a photosensitive acid generator, an organic base, and an organic crosslinking agent. The film is patternwise imaged and at least one region is exposed to radiation having a wavelength of about 248 nanometers. The film is baked, resulting in inducing crosslinking in the film. The film is developed resulting in removal of base-soluble unexposed regions of the film, wherein a relief pattern from the film remains. The relief pattern is cured at a temperature between about 300° C. and about 450° C., and the curing utilizes a combination of thermal treatment with UV radiation.