The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
Oct. 09, 2007
Gottfried Beer, Nittendorf, DE;
Christoph Kienmayer, Unterhaching, DE;
Klaus Pressel, Regensburg, DE;
Werner Simbuerger, Haar, DE;
Gottfried Beer, Nittendorf, DE;
Christoph Kienmayer, Unterhaching, DE;
Klaus Pressel, Regensburg, DE;
Werner Simbuerger, Haar, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principal surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principal surface.