The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2011

Filed:

Feb. 06, 2006
Applicant:

Rick C. Lake, Meridian, ID (US);

Inventor:

Rick C. Lake, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic die, a plurality of electrical couplers projecting from the die, and a flowable material disposed on the die. The die includes an integrated circuit and a plurality of terminals operably coupled to the integrated circuit. The electrical couplers are attached to corresponding terminals on the die. The flowable material includes a plurality of spacer elements sized to space the die apart from another component. The flowable material may be a no-flow underfill, a flux compound, or other suitable material.


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