The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2010

Filed:

Aug. 15, 2008
Applicant:

Shiann-tsong Tsai, Hsinchu, TW;

Inventor:

Shiann-Tsong Tsai, Hsinchu, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-substrate region-based package and a method for fabricating the same are provided. An active surface of a chip is divided into a plurality of functional regions, and each of the functional regions is electrically connected to a corresponding substrate via bonding wires. Each of the functional regions has a separate system, and the circuit layout thereof is not limited by the substrate or other systems but can be flexibly and independently designed, thereby allowing the package to be made smaller and thinner. Each set of the functional region and its corresponding substrate functions as an independent unit, such that the substrates are not affected by each other, thereby providing good compatibility, improved reliability and reduced packaging area.


Find Patent Forward Citations

Tsai, Shiann-Tsong. (2010). Multi-substrate region-based package and method for fabricating the same (U.S. Patent No. 7859118). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7859118

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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