The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2010

Filed:

Aug. 04, 2006
Applicants:

Bong-tae Park, Seoul, KR;

Jeong-hyuk Choi, Gyeonggi-do, KR;

Inventors:

Bong-Tae Park, Seoul, KR;

Jeong-Hyuk Choi, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/788 (2006.01); H01L 29/792 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of fabricating a nonvolatile memory device include forming a trench mask pattern on a semiconductor substrate including a first region and a second region. Substrate trenches defining active regions are formed in the semiconductor substrate in the first region and the second region using the trench mask pattern as a mask. Device isolation layer patterns are formed on the semiconductor substrate including the trench mask pattern and substrate trenches. The device isolation patterns fill the substrate trenches in the first region and in the second region. First and second openings are formed exposing top surfaces of the corresponding active regions in the first and second regions by removing the trench mask pattern. The second opening has a greater width than the first opening. A first lower conductive pattern is formed in the first opening and has a bottom portion in a lower region of the first opening and an extended portion extending from the bottom portion to an upper region of the first opening. The extended portion has a smaller width than the bottom portion. A second lower conductive pattern is formed filling the second opening.


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