The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2010
Filed:
Aug. 24, 2006
Applicants:
Akihiko Endo, Tokyo, JP;
Hideki Nishihata, Tokyo, JP;
Nobuyuki Morimoto, Tokyo, JP;
Inventors:
Assignee:
Sumco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01);
U.S. Cl.
CPC ...
Abstract
Adhesion of particles due to static buildup during a laminated substrate manufacturing process is constrained, so as to reduce generation of a void or a blister in a lamination step and improve yield. A laminateis formed by superimposing a first semiconductor substrate, which is to be an active layer, on a second semiconductor substrate, which is to be a supporting substrate, via an oxide film. Electric resistance of either or both of the first and second semiconductor substratesandbefore superimposition is 0.005-0.2 Ωcm.