The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2010
Filed:
Sep. 21, 2007
Applicants:
Klaus Pressel, Regensburg, DE;
Gottfried Beer, Nittendorf, DE;
Inventors:
Klaus Pressel, Regensburg, DE;
Gottfried Beer, Nittendorf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
Stacked semiconductor chips are disclosed. One embodiment provides an array of first semiconductor chips, covering the array of the first semiconductor chips with a mold material, and placing an array of second semiconductor chips over the array of the first semiconductor chips. The thicknesses of the second semiconductor chips is reduced. The array of the first semiconductor chips are singulated by dividing the mold material.