The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Feb. 19, 2008
Brian L. Carlson, Rochester, MN (US);
Bruce J. Chamberlin, Vestal, NY (US);
Mark K. Hoffmeyer, Rochester, MN (US);
Ahmad D. Katnani, Poughkeepsie, NY (US);
Matthew S. Kelly, Ontario, CA;
Gregory S. Killinger, Rochester, MN (US);
Eric V. Kline, Rochester, MN (US);
Wayne J. Rothschild, Rochester, MN (US);
Jeffrey A. Taylor, Rochester, MN (US);
Brian L. Carlson, Rochester, MN (US);
Bruce J. Chamberlin, Vestal, NY (US);
Mark K. Hoffmeyer, Rochester, MN (US);
Ahmad D. Katnani, Poughkeepsie, NY (US);
Matthew S. Kelly, Ontario, CA;
Gregory S. Killinger, Rochester, MN (US);
Eric V. Kline, Rochester, MN (US);
Wayne J. Rothschild, Rochester, MN (US);
Jeffrey A. Taylor, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink, and a third sensor is located on the component or the attachment with a portion of the attachment disposed between the third sensor and the first and second heat sink region sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment portion, and the component with respect to heat conduction, which includes identifying the interposed heat sink portion as failing in response to a divergence between temperature inputs from the first and second heat sink region sensors. Rate-of-rise temperature readings may also be observed and compared, including to historical values.