The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2010

Filed:

Jul. 30, 2008
Applicant:

Shinichi Okita, Nishitokyo, JP;

Inventor:

Shinichi Okita, Nishitokyo, JP;

Assignee:

Nikon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wafer measurement/inspection instrument receives information on at least one of a processing result and an operating state of at least one of a coater/developer that performs film forming/resist processing to a wafer and an exposure apparatus that performs liquid immersion exposure to the wafer, and optimizes inspection conditions of the wafer based on the received information (stepsand). With this operation, quality inspection of the wafer can be efficiently performed, and as a consequence, it becomes possible to efficiently perform processing to the wafer.


Find Patent Forward Citations

Okita, Shinichi. (2010). Substrate processing method, substrate processing system, program, and recording medium (U.S. Patent No. 7855784). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7855784

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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