The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Nov. 12, 2004
Issaku Sato, Tokyo, JP;
Sinzo Nakamura, Mooka, JP;
Naoki Sato, Tochigi, JP;
Toshio Hakuto, Tochigi, JP;
Issaku Sato, Tokyo, JP;
Sinzo Nakamura, Mooka, JP;
Naoki Sato, Tochigi, JP;
Toshio Hakuto, Tochigi, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a Cu—Sn based alloy. A Bi—Sn based alloy or a Bi—In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.