The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2010
Filed:
Dec. 23, 2008
Christopher M. Scanlan, Hellerup, DK;
Christopher M. Scanlan, Hellerup, DK;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package has a first substrate having a plurality of metal traces. At least one die is electrically coupled to the first surface of the first substrate. A plurality of land pads is formed on the first surface of the first substrate. A mold compound encapsulates portions of the die and portions of the first surface of the first substrate. A conductive coating is applied to the mold compound and electrically coupled to at least one metal trace. A non-conductive coating is formed over the conductive coating and portions of the mold compound. A plurality of vias is formed through the non-conductive coating and the mold compound to expose the land pads.