The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Aug. 23, 2006
Toshihiro Yonezawa, Yamanashi, JP;
Syuichi Tsukada, Yamanashi, JP;
Toshihiro Yonezawa, Yamanashi, JP;
Syuichi Tsukada, Yamanashi, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe cardhas a contactorfor supporting a probe, a printed wiring boardelectrically connected to the contactor, and a reinforcement member. On the upper surface side of the probe cardis provided a top plateconnected to the reinforcement memberby a connection member. A grooveis formed in the upper surface of the top plate, and a strain gaugeis attached at the groove. When a wafer W and the probeare in contact with each other, an upward load acts on the probe cardby pressure caused by the contact, and the load causes strain in the top plate. The amount of the strain in the top plateis measured, and contact pressure between the wafer W and the probeis regulated and set based on the amount of the strain.