The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Jul. 07, 2009
Hyun-soo Chung, Gyeonggi-do, KR;
In-young Lee, Gyeonggi-do, KR;
Son-kwan Hwang, Gyeonggi-do, KR;
Dong-ho Lee, Gyeonggi-do, KR;
Seong-deok Hwang, Seoul, KR;
Hyun-Soo Chung, Gyeonggi-do, KR;
In-Young Lee, Gyeonggi-do, KR;
Son-Kwan Hwang, Gyeonggi-do, KR;
Dong-Ho Lee, Gyeonggi-do, KR;
Seong-Deok Hwang, Seoul, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Wafer level packages and methods of fabricating the same are provided. In one embodiment, one of the methods comprises forming semiconductor chips having a connection pad on a wafer, patterning a bottom surface of the wafer to form a trench under the connection pad, patterning a bottom surface of the trench to form a via hole exposing the bottom surface of the connection pad, and forming a connecting device connected to the connection pad through the via hole. The invention provides a wafer level package having reduced thickness, lower fabrication costs, and increased reliability compared to conventional packages.