The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Aug. 27, 2009
Kyung Seob OH, Incheon, KR;
Jae KY Roh, Gyunggi-do, KR;
Jung Kyu Park, Seoul, KR;
Jong Hwan Baek, Seoul, KR;
Seung Hwan Choi, Seoul, KR;
Kyung Seob Oh, Incheon, KR;
Jae Ky Roh, Gyunggi-do, KR;
Jung Kyu Park, Seoul, KR;
Jong Hwan Baek, Seoul, KR;
Seung Hwan Choi, Seoul, KR;
Samsung LED Co., Ltd., Gyunggi-do, KR;
Abstract
A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.