The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2010

Filed:

Jan. 09, 2009
Applicants:

Mark G. Stinson, Wood River, IL (US);

Madhavan S. Esayanur, St. Peters, MO (US);

Dennis Buese, O'Fallon, MO (US);

Emanuele Corsi, Novara, IT;

Ezio Bovio, Novara, IT;

Antonio Maria Rinaldi, Novara, IT;

Larry Flannery, Warrenton, MO (US);

Inventors:

Mark G. Stinson, Wood River, IL (US);

Madhavan S. Esayanur, St. Peters, MO (US);

Dennis Buese, O'Fallon, MO (US);

Emanuele Corsi, Novara, IT;

Ezio Bovio, Novara, IT;

Antonio Maria Rinaldi, Novara, IT;

Larry Flannery, Warrenton, MO (US);

Assignee:

MEMC Electronic Materials, Inc., St. Peters, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2006.01); B24B 51/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.


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