The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2010

Filed:

Sep. 28, 2007
Applicants:

Eric D. Hobbs, Livermore, CA (US);

Nobuhiro Kawamata, Yokohama, JP;

Andrew W. Mcfarland, Dublin, CA (US);

Carl V. Reynolds, Pleasanton, CA (US);

Yoichi Urakawa, Yokohama, JP;

Inventors:

Eric D. Hobbs, Livermore, CA (US);

Nobuhiro Kawamata, Yokohama, JP;

Andrew W. McFarland, Dublin, CA (US);

Carl V. Reynolds, Pleasanton, CA (US);

Yoichi Urakawa, Yokohama, JP;

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.


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