The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Aug. 12, 2008
Applicants:
Sung Su Park, Seoul, KR;
Jin Young Kim, Kwangju, KR;
Jeong Gi Jin, Jeju-do, KR;
Inventors:
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a semiconductor package. The semiconductor package is configured to form a plurality of through holes for forming a through silicon via at once using a sawing device used for wafer sawing instead of a separate laser drilling equipment or a deep reactive ion etching (DRIE) equipment. Accordingly, the semiconductor package saves fabricating time and increases fabrication yield, saves costs for a laser drilling equipment or a DRIE equipment, and prevents various defects generated in an inner portion of a through hole in the case of using the laser drilling equipment or the DRIE equipment.