The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7842518 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 30, 2010

Filed:

Nov. 01, 2007
Applicant:

Hideshi Miyajima, Kanagawa, JP;

Inventor:

Hideshi Miyajima, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a semiconductor device, includes forming a porous dielectric film above a substrate using a porous insulating material, forming an opening in the porous dielectric film, repairing film quality of the porous dielectric film on a surface of the opening by feeding a predetermined gas replacing a Si—OH group to the opening, and performing pore sealing of the surface of the opening using the same predetermined gas as that used for film quality repairs after repairing the film quality.

Published as:
US2008108153A1; JP2008117903A; TW200836294A; US7842518B2; TWI358105B;

Find Patent Forward Citations

Miyajima, Hideshi. (2010). Method for fabricating semiconductor device (U.S. Patent No. 7842518). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7842518

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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