The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Apr. 25, 2007
Applicants:
Satoru Katsurayama, Tokyo, JP;
Tomoe Yamashiro, Tokyo, JP;
Tetsuya Miyamoto, Tokyo, JP;
Inventors:
Assignee:
Sumitomo Bakelite Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
An adhesive tapeelectrically connecting conductive components includes a resin layercontaining a thermosetting resin, a solder powderand a curing agent. The solder powderand the curing agent reside in the resin layer, the curing temperature Tof the resin layerand the melting point Tof the solder powdersatisfy T≧T+20° C., wherein the resin layershows a melt viscosity of 50 Pa·s or above and 5000 Pa·s or below, at the melting point Tof the solder powder