The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Sep. 28, 2005
Ming-da Guo, Tainan, TW;
Pin-chieh HU, Tainan, TW;
Hung-cheng Chen, Taipen, TW;
Kuan-hsiao Lin, Daliao Township, Kaohsiung County, TW;
Wen-chang Peng, Tainan, TW;
Hsiao-pin Shih, Kaohsiung, TW;
Chyi-shyuan Chern, Taipei, TW;
Ming-Da Guo, Tainan, TW;
Pin-Chieh Hu, Tainan, TW;
Hung-Cheng Chen, Taipen, TW;
Kuan-Hsiao Lin, Daliao Township, Kaohsiung County, TW;
Wen-Chang Peng, Tainan, TW;
Hsiao-Pin Shih, Kaohsiung, TW;
Chyi-Shyuan Chern, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
An electroplating system is provided. The system comprises a reaction tank, a tube, and a video bubble detector. The reaction tank, having a first diameter, contains a plating solution. The tube, connecting to the reaction tank, comprises an inflow tube and a branch, wherein the inflow tube inputs the plating solution into the reaction tank, and the branch has an enlarged part having the first diameter. The video bubble detector, mounted on the enlarged part of the branch, detects the presence of a bubble in the plating solution flowing through the branch.