The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2010

Filed:

Aug. 25, 2008
Applicants:

Masahiro Takizawa, Nagaoka, JP;

Teruhide Nishino, Yokohama, JP;

Inventors:

Masahiro Takizawa, Nagaoka, JP;

Teruhide Nishino, Yokohama, JP;

Assignee:

ASM Japan K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor manufacturing apparatus includes a processing unit for processing at least one wafer; a loading/unloading unit for loading/unloading at least wafer; an input/output chamber for taking in a processed wafer from the processing unit and taking out the processed wafer to the loading/unloading unit, and taking in a unprocessed wafer from the loading/unloading unit and taking out the unprocessed wafer to the reaction unit; and a wafer inspection device for inspecting the processed wafer through a light transmittable top portion of the input/output chamber, through which light is transmittable, while the processed wafer is temporarily placed in the input/output chamber.


Find Patent Forward Citations

Takizawa, Masahiro. (2010). Semiconductor manufacturing apparatus equipped with wafer inspection device and inspection techniques (U.S. Patent No. 7832353). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7832353

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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