The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Apr. 24, 2007
Mitsuo Sugino, Tokyo, JP;
Satoru Katsurayama, Tokyo, JP;
Tomoe Yamashiro, Tokyo, JP;
Tetsuya Miyamoto, Tokyo, JP;
Hiroyuki Yamashita, Tokyo, JP;
Mitsuo Sugino, Tokyo, JP;
Satoru Katsurayama, Tokyo, JP;
Tomoe Yamashiro, Tokyo, JP;
Tetsuya Miyamoto, Tokyo, JP;
Hiroyuki Yamashita, Tokyo, JP;
Sumitomo Bakelite Company, Ltd., Tokyo, JP;
Abstract
A semiconductor device () comprises a first resin substrate () on which a first semiconductor chip () is mounted a surface thereof; a second resin substrate () on which a second semiconductor chip () is mounted on a surface thereof; and a resin base material (), joined to a front surface of the first resin substrate () and to a back surface of the second resin substrate (), so that these surfaces are electrically connected. The resin base material () is disposed in a circumference of the first resin substrate () in the surface of the first resin substrate (). Further, the first semiconductor chip () is disposed in a space section provided among the first resin substrate (), the second resin substrate () and the resin base material () in the surface of the first resin substrate ().