The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Nov. 08, 2007
Wataru Takahashi, Chino, JP;
Yoshinao Miyata, Matsukawa-machi, JP;
Kazushige Umetsu, Chino, JP;
Yutaka Yamazaki, Suwa, JP;
Wataru Takahashi, Chino, JP;
Yoshinao Miyata, Matsukawa-machi, JP;
Kazushige Umetsu, Chino, JP;
Yutaka Yamazaki, Suwa, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A method for dividing a wafer into a plurality of chips is provided. The method includes providing recesses in a surface of the wafer at positions along boundaries between regions to become the individual chips, providing fragile portions having a predetermined width inside the wafer at positions along the boundaries by irradiation of the other surface of the wafer with a laser beam whose condensing point is placed inside the wafer, the fragile portions including connected portions at least at one of the surfaces of the wafer, and dividing the wafer at the fragile portions into the individual chips by applying an external force to the wafer.