The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7821283 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 26, 2010

Filed:

Dec. 20, 2006
Applicants:

Daisuke Yamada, Hidaka, JP;

Kiyoshi Kimura, Hidaka, JP;

Fujio Hara, Hidaka, JP;

Inventors:

Daisuke Yamada, Hidaka, JP;

Kiyoshi Kimura, Hidaka, JP;

Fujio Hara, Hidaka, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein are a circuit board device for wafer inspection having high connection reliability, and a probe card and a wafer inspection apparatus, which are equipped with this circuit board device for wafer inspection. The circuit board device for wafer inspection has a board body and a connector device provided on the board body and obtained by stacking a plurality of connector units on each other, wherein each of the connector units has a first anisotropically conductive elastomer sheet, a composite conductive sheet, a second anisotropically conductive elastomer sheet and a pitch converting board, the composite conductive sheet has an insulating sheet, in which a plurality of through-holes have been formed, and rigid conductors respectively arranged into the through-holes in this insulating sheet so as to protrude from both surfaces of the insulating sheet, and in each of the rigid conductors, terminal portions having a diameter greater than the diameter of the through-hole are formed on both ends of a body portion inserted into the through-hole in the insulating sheet in order for the conductor to be provided movably in the thickness-wise direction of the insulating sheet.


Find Patent Forward Citations

Yamada, Daisuke. (2010). Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus (U.S. Patent No. 7821283). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7821283

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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