The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7820051 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 26, 2010

Filed:

Feb. 23, 2007
Applicants:

Rui Fang, Fishkill, NY (US);

Deepak Kulkarni, Wappingers Falls, NY (US);

David K. Watts, Hopewell Junction, NY (US);

Inventors:

Rui Fang, Fishkill, NY (US);

Deepak Kulkarni, Wappingers Falls, NY (US);

David K. Watts, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method, process and system for the recycling of electrochemical-mechanical planarization slurries/electrolytes as they are used in the back end of line of the semiconductor wafer manufacturing process is disclosed. The method, process and system includes with the removal of metal ions from slurries using ion exchange media and/or electrochemical deposition.


Find Patent Forward Citations

Fang, Rui. (2010). Recycling of electrochemical-mechanical planarization (ecmp) slurries/electrolytes (U.S. Patent No. 7820051). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7820051

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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