The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Sep. 12, 2007
Carsten Ahrens, Pettendorf, DE;
Sven Albers, Regensburg, DE;
Klaus Gnannt, Stadtbergen, DE;
Ulrich Krumbein, Rosenheim, DE;
Gunther Mackh, Neumarkt, DE;
Patrick Schelauske, Bergkirchen, DE;
Berthold Schuderer, Regensburg, DE;
Georg Seidemann, Laudshut, DE;
Carsten Ahrens, Pettendorf, DE;
Sven Albers, Regensburg, DE;
Klaus Gnannt, Stadtbergen, DE;
Ulrich Krumbein, Rosenheim, DE;
Gunther Mackh, Neumarkt, DE;
Patrick Schelauske, Bergkirchen, DE;
Berthold Schuderer, Regensburg, DE;
Georg Seidemann, Laudshut, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.