The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Apr. 02, 2008
Chien Liu, Kaohsiung, TW;
Chien Liu, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A package structure and a manufacturing method thereof are provided. The package structure includes a leadframe, a die, a solder layer and several connecting components. The leadframe includes a heat dissipation pad and several leads. The heat dissipation pad is disposed in a substantial center of the leadframe. The leads are surrounding the heat dissipation pad. The die having an active surface is disposed on the leadframe. The solder layer is disposed between the active surface and the heat dissipation pad. The connecting components are disposed between the active surface and the leads. The die is electrically connected to the leadframe through the solder layer and the connecting components.