The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Apr. 11, 2007
Kun Xu, Fremont, CA (US);
Jimin Zhang, San Jose, CA (US);
James C. Wang, Saratoga, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Yutao MA, Fremont, CA (US);
Steven M. Zuniga, Soquel, CA (US);
Jin Yi, Sunnyvale, CA (US);
Kun Xu, Fremont, CA (US);
Jimin Zhang, San Jose, CA (US);
James C. Wang, Saratoga, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Yutao Ma, Fremont, CA (US);
Steven M. Zuniga, Soquel, CA (US);
Jin Yi, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardness. The plastic abrasive portion comprises a base plate and a plurality of plastic nodules formed on a surface of the base plate, each of the plastic nodules having a planar top surface, wherein the planar top surface is positioned to substantially contact a polishing pad. The brush portion may be positioned adjacent to the plastic abrasive portion, the brush portion having a plurality of brush elements positioned to substantially contact the pad.