The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
May. 06, 2008
Chang Deok Lee, Uijeongbu-si, KR;
DO Hyun NA, Dongjak-gu, KR;
Chang Deok Lee, Uijeongbu-si, KR;
Do Hyun Na, Dongjak-gu, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
Disclosed is a lead frame, a semiconductor device and a fabrication method related to the semiconductor device. Since the lead frame has a land connecting bar, an upper surface of which is half-etched, the land connecting bar is more easily removed by a blade than a conventional land connecting bar in a fabrication process for the semiconductor device. Accordingly, stress applied to the lands when the land connecting bar is removed is reduced, and a flatness of the lands is maintained. Also, first and second lands constituting the lands are alternately formed with the land connecting bar, leads are alternately formed with the second lands, and wire bonding regions of the leads are positioned on a plane higher than the second lands. Accordingly, an interval between the conductive wires can be constantly maintained and the conductive wires have different traces, thus preventing a short between the conductive wires due to wire sweeping in an encapsulation process.