The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2010

Filed:

Nov. 21, 2007
Applicant:

Wei-min Hsiao, Kao-Hsiung, TW;

Inventor:

Wei-Min Hsiao, Kao-Hsiung, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
Abstract

A MEMS microphone module having an application specific IC and a microphone chip is disclosed. The application specific IC has a plurality of first vias and a plurality of first pads, and the first vias are connected to the first pads. The microphone chip has a resonant cavity, a plurality of second vias and a plurality of second pads, and the second vias are connected to the second pads. The microphone chip is disposed on a first surface of the application specific IC with an opening of the resonant cavity facing toward a first surface of the application specific IC. The second conductive vias of the microphone chip are also electrically connected to the first vias of the application specific IC. By placing the microphone chip on the first surface of the application specific IC, the present invention could reduce the package size and increase the reliability of the package.


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