The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Apr. 24, 2008
Kazuhiro Tashiro, Kawasaki, JP;
Keisuke Fukuda, Kawasaki, JP;
Naohito Kohashi, Kanagawa, JP;
Shigeyuki Maruyama, Kanagawa, JP;
Kazuhiro Tashiro, Kawasaki, JP;
Keisuke Fukuda, Kawasaki, JP;
Naohito Kohashi, Kanagawa, JP;
Shigeyuki Maruyama, Kanagawa, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.