The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7807479 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 05, 2010

Filed:

Feb. 21, 2007
Applicant:

Paul C. Lindsey, Jr., Lafayette, CA (US);

Inventor:

Paul C. Lindsey, Jr., Lafayette, CA (US);

Assignee:

Micro Processing Technology, Inc., Lafayette, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

When scribing a substrate, the precise location of the outer peripheral edge of the substrate on a stage is determined and movement of a scribe tool is controlled to first bring the scribe tool into engagement with the substrate at a location inwardly of the outer peripheral edge of the substrate. After a downwardly directed force of predetermined magnitude exerted by the scribe tool has been attained and stabilized, the scribe tool is moved along the substrate to form a scribe line.


Find Patent Forward Citations

Lindsey, Jr., Paul. (2010). Method and apparatus for improving force control in wafer scribing (U.S. Patent No. 7807479). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7807479

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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