The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Jul. 11, 2005
Mayo Uenoyama, Osaka, JP;
Yasuhiro Okuda, Osaka, JP;
Fumihiro Hayashi, Osaka, JP;
Taro Fujita, Osaka, JP;
Yasuhito Masuda, Osaka, JP;
Yuichi Idomoto, Osaka, JP;
Mayo Uenoyama, Osaka, JP;
Yasuhiro Okuda, Osaka, JP;
Fumihiro Hayashi, Osaka, JP;
Taro Fujita, Osaka, JP;
Yasuhito Masuda, Osaka, JP;
Yuichi Idomoto, Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.