The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
May. 12, 2008
Applicants:
Kiyotaka Kizaki, Ota-Ku, JP;
Satoshi Yamanaka, Ota-ku, JP;
Inventors:
Kiyotaka Kizaki, Ota-Ku, JP;
Satoshi Yamanaka, Ota-ku, JP;
Assignee:
Disco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor wafer assembly includes a disk-shaped semiconductor wafer including on a face side thereof a flat area having a plurality of semiconductor devices formed thereon and a beveled surface disposed around the flat surface, and a circular adhesive film bonded to a reverse side of the semiconductor wafer. The adhesive film is bonded only to an area of the reverse side which is coextensive with the flat area.
Kizaki, Kiyotaka. (2010). Semiconductor wafer assembly and method of processing semiconductor wafer (U.S. Patent No. 7804156). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7804156
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile