The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7799701 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 21, 2010

Filed:

May. 28, 2008
Applicants:

Seiji Heike, Kawagoe, JP;

Tomihiro Hashizume, Hatoyama, JP;

Masayoshi Ishibashi, Tokyo, JP;

Inventors:

Seiji Heike, Kawagoe, JP;

Tomihiro Hashizume, Hatoyama, JP;

Masayoshi Ishibashi, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of coating by supplying a liquid material from a nozzle tip to form a film on a substrate surface facing to the nozzle, having the steps of: preparing a translation mechanism, which is capable of moving the nozzle in an in-plane direction and in a thickness direction of the substrate; making the nozzle to come gradually closer to the substrate, after positioning of the nozzle on the in-plane of the substrate, by using the translation mechanism; detecting electric current flowing through the nozzle from the substrate surface, when a semiconductor droplet supplied from the nozzle tip contacts with an electrode installed at the substrate surface; stopping accession of the nozzle to the substrate, when the electric current exceeds threshold value set in advance; and making the nozzle tip apart from the substrate farther than in the stopping, so as to coat the substrate with the liquid material.


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