The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Oct. 27, 2006
Mike Rice, Pleasanton, CA (US);
Jeffrey Hudgens, San Francisco, CA (US);
Charles Carlson, Cedar Park, TX (US);
William Tyler Weaver, Austin, TX (US);
Robert Lowrance, Los Gatos, CA (US);
Eric Englhardt, Palo Alto, CA (US);
Dean C. Hruzek, Austin, TX (US);
Dave Silvetti, Morgan Hill, CA (US);
Michael Kuchar, Austin, TX (US);
Kirk Van Katwyk, Tracy, CA (US);
Van Hoskins, Round Rock, TX (US);
Vinay Shah, San Mateo, CA (US);
Mike Rice, Pleasanton, CA (US);
Jeffrey Hudgens, San Francisco, CA (US);
Charles Carlson, Cedar Park, TX (US);
William Tyler Weaver, Austin, TX (US);
Robert Lowrance, Los Gatos, CA (US);
Eric Englhardt, Palo Alto, CA (US);
Dean C. Hruzek, Austin, TX (US);
Dave Silvetti, Morgan Hill, CA (US);
Michael Kuchar, Austin, TX (US);
Kirk Van Katwyk, Tracy, CA (US);
Van Hoskins, Round Rock, TX (US);
Vinay Shah, San Mateo, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method and apparatus for processing substrates using a cluster tool that has an increased system throughput, increased system reliability, improved device yield performance, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robot assemblies that are configured in a parallel processing configuration and adapted to move in a vertical and a horizontal direction to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms.