The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2010

Filed:

Oct. 11, 2005
Applicants:

Jian Zhang, Schenectady, NY (US);

Sandeep Shrikant Tonapi, Niskayuna, NY (US);

Ryan Christopher Mills, Rexford, NY (US);

Arun Virupaksha Gowda, Niskayuna, NY (US);

Inventors:

Jian Zhang, Schenectady, NY (US);

Sandeep Shrikant Tonapi, Niskayuna, NY (US);

Ryan Christopher Mills, Rexford, NY (US);

Arun Virupaksha Gowda, Niskayuna, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 25/00 (2006.01); B32B 17/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.


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