The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2010

Filed:

Jan. 18, 2006
Applicants:

Yogo Kawasaki, Ogaki, JP;

Hiroaki Satake, Ogaki, JP;

Yutaka Iwata, Ogaki, JP;

Tetsuya Tanabe, Ogaki, JP;

Inventors:

Yogo Kawasaki, Ogaki, JP;

Hiroaki Satake, Ogaki, JP;

Yutaka Iwata, Ogaki, JP;

Tetsuya Tanabe, Ogaki, JP;

Assignee:

IBIDEN Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/04 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

Through holesare formed to penetrate a core substrateand lower interlayer resin insulating layers, and via holesare formed right on the through holes, respectively. Due to this, the through holesand the via holesare arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holesand the via holesto be connected to solder bumps(conductive connection pins), respectively, are directly connected to one another, excellent reliability in connection is ensured.


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