The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2010

Filed:

Apr. 19, 2007
Applicants:

John T. Gasner, Satellite Beach, FL (US);

Michael D. Church, Sebastian, FL (US);

Sameer D. Parab, Fremont, CA (US);

Paul E. Bakeman, Jr., South Burlington, VT (US);

David A. Decrosta, Melbourne, FL (US);

Robert Lomenick, Palm Bay, FL (US);

Chris A. Mccarty, Melbourne, FL (US);

Inventors:

John T. Gasner, Satellite Beach, FL (US);

Michael D. Church, Sebastian, FL (US);

Sameer D. Parab, Fremont, CA (US);

Paul E. Bakeman, Jr., South Burlington, VT (US);

David A. Decrosta, Melbourne, FL (US);

Robert Lomenick, Palm Bay, FL (US);

Chris A. McCarty, Melbourne, FL (US);

Assignee:

Intersil Americas Inc., Milipitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is harder than the conductor to form pillars of relatively hard material that extend through the conductor and forming an insulation layer of the insulation material between the conductor and the bond pad.


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