The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Dec. 13, 2007
Kenji Orito, Saitama, JP;
Toshiharu Hayashi, Naka-gun, JP;
Masahiro Wada, Ageo, JP;
Reiko Izumi, Mito, JP;
Koji Hoshino, Kounosu, JP;
Kenji Orito, Saitama, JP;
Toshiharu Hayashi, Naka-gun, JP;
Masahiro Wada, Ageo, JP;
Reiko Izumi, Mito, JP;
Koji Hoshino, Kounosu, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
Porous titanium having a low contact resistance includes porous titanium body, Au, and Ti oxide layer (). Porous titanium includes continuous holes () opening on a surface and being connected to inner holes and a skeleton (). Au adheres to at least an outer skeletal surface () of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer () is formed in a clearance between adjacent Au cords () of the Au network sticking. The width of an Au cord () of the Au network is 0.3 to 10 μm at least at one position; and the thickness of the Ti oxide layer (), which is formed in the clearance between adjacent Au cords () of the Au network is 30 to 150 nm.