The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Dec. 27, 2006
Michiel Puyt, Veldhoven, NL;
Arno Jan Bleeker, Westerhoven, NL;
Johannes Hendrikus Gertrudis Franssen, Eersel, NL;
Rene Theodorus Petrus Compen, Valkenswaard, NL;
Johannes Theodorus Guillielmus Maria Van DE Ven, Eindhoven, NL;
Egbert Dirk Stam, Veldhoven, NL;
Rudolf Hartmut Fischer, Mierlo, NL;
Edwin Robert Martin Gelinck, Boxtel, NL;
Michiel Puyt, Veldhoven, NL;
Arno Jan Bleeker, Westerhoven, NL;
Johannes Hendrikus Gertrudis Franssen, Eersel, NL;
Rene Theodorus Petrus Compen, Valkenswaard, NL;
Johannes Theodorus Guillielmus Maria Van De Ven, Eindhoven, NL;
Egbert Dirk Stam, Veldhoven, NL;
Rudolf Hartmut Fischer, Mierlo, NL;
Edwin Robert Martin Gelinck, Boxtel, NL;
ASML Netherlands B.V., Veldhoven, NL;
Abstract
A lithographic apparatus includes an illumination system constructed and arranged to condition a radiation beam, and a support constructed and arranged to support a patterning device. The patterning device is capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. The apparatus also includes a substrate table constructed and arranged to hold a substrate, and a projection system constructed and arranged to project the patterned radiation beam onto a target portion of the substrate. The substrate table includes a chuck having a plurality of protrusions constructed and arranged to support corresponding parts of a bottom surface of a wafer. The top surface of at least one of the protrusions includes a plurality of elements that define a reduced contact area between the substrate and the top surface of the protrusion.